XGSPON
XGSPON STICK
XGSPON 칩과 광부품일체형 SFP+ ONU 제품(ZXOS11NPI, ZXOS11EPI)
Product Features
- Low Power Consumption SFP+ Formfactor with Embedded ZX300 SoC
- Compliant with standard SFP+ form factor SFF-8431, SFF-8472, GR-468
- XGS-PON uplink, G.9807 series and G.988 GPON OMCI compliant
- Very low power consumption, typically less than 2W
- SFF-8472 DDM
- Class N1/N2
- APD Receiver : -28.5dBm
- 1270nm DFB Burst Laser
- Commercial/Industrial Temperature
- IEEE 1588, ToD, SyncE Support(Only EPI supports SyncE)
- 10G XFI Interface
Specification
ZARAM 10Gbps PON-STIC Specification
| Main Chip | ZARAM SoC (ZX300) |
|---|---|
| Flash Memory | Embedded 256Mbit (Serial Flash*1) |
| Memory | Embedded 512Mbit, LPDDR |
| Optical Launched Power | +4.0 ~ +9.0dBm |
| Wavelength | 1577nm Downstream, 1270nm Upstream |
| Rx Sensitivity | ≤ -28.5dBm (PRBS223-1@9.953G, ER 8.2 TX) |
| Uplink Interface | 10 GPON Port (SC/UPC, SFP compliant interface) |
| Service Interface | SFP+ XFI interface |
| Rich synchronization feature set | IEEE 1588v2 8275.1 T-BC with G.8273.2 Class B performance, ToD/1PPS |